PACOFLEX™ ULTRA is the ultimate conformable release film for scrap-free applications for the lamination of cover layers and flexible circuits. It is fine-tuned to reduce excessive “squeeze-out” of adhesive into pad areas and will also effectively block adhesive or resin flow into any other unwanted areas.
- “Matte” side releasable! No out-gassing or contaminant transfer that will affect solder adhesion
- Engineered conformance layer that prevents uncontrolled “squeeze-out” and meets Mil and IPC Specs
- “Ultra smooth” surface finish for superior adhesive flow control Extremely low X-Y axis movement
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