PACO•VIA™ 3200 & 3000 is a two-sided release film designed to be part of a Two-Component System (PACO•VIA™ 3200 and PACOPADS™) as a performance-driven line of High-Temperature, Resin-Blocking Release Films. The PACO•VIA™ System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards. PACO•VIA™ 3200 allows the user to select an alternative release film that may be better suited for less robust post lamination cleaning processes.
- Two engineered Grades to fit all sequential lamination demands
- Used with PACOPADS™ Pressure Equalizing Press Pads
- Designed to suit all lamination process parameters
- Operating temperature of 425°F / 218°C for up to 4 hours
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