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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
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    • Company News
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    • PUMANEWS™ Newsletter
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suppliers

JX Nippon Mining & Metals

About JX Nippon

JX Nippon Mining & Metals is the only supplier with an integrated manufacturing system, covering mining copper concentrate, smelting and refining copper, producing copper ingots, rolling ingots into foil, and surface treating of foils, within the same Group. JX Nippon has outstanding production and quality management systems supporting global top market shares. At the same time, utilizing our integrated manufacturing system, we are developing and supplying the broadest range of treated rolled copper foil products to satisfy customers’ needs. As the best approach to higher quality in flexible printed circuit boards, we confidently recommend their Treated Rolled Copper Foil.

Product Lines

JX Nippon Mining and Metals JTCS-P1

Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.

Product Details
JX Nippon Mining and Metals JTCLC

Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic-free with zinc treatment properties. 

Product Details
JX Nippon Mining and Metals JXEFL

Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.

Product Details
JX Nippon Mining and Metals HA-V2

Very low-profile, rolled-wrought, low-temperature annealable foil with excellent dynamic and static flex properties due to enlarged grain structure and orientation. Suitable for Flexible and Rigid-Flex PCB applications.

Product Details
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