Indubond® X1
Description
A single head induction bonding system which incorporates a manual multi-line tooling plate with either round and/or slotted pins for pinless lamination. Can support either Rigid or Rigid-flex designs, panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.
Key Properties
- Compact design to incorporate into exsisting shop floor space to support low volume or protoype work.
- Weld zones have no thickness are flat and will not impact flow and fill of resin nor impact to coupons.
- Bonded zones can withstand dilation and shrinkage of a hot press cycles upto 850 F per the Indubond X-press.
- Effective at bonding all standard material and High Tg targets too including halogen free chemistries.
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