InduBond® 130N
Description
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a Single draw layup function and incorporated tooling plate for registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
Key Properties
- Bonding heads press & heat via thermal energy transfer to bond predetermined welding zones until the inner layer, prepreg & resin is fused and cured.
- Weld zones have no thickness are flat and will not impact flow and fill of resin with no impact to coupons.
- Bonded zones can withstand dilation and shrinkage of a hot press cycles upto 850 F per the InduBond® X-press.
- Effective at bonding all standard material and High Tg targets too including halogen free chemistries.
Tools
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