Strips tin and solder etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish.
- Concentrated formulation allows the user to maintain fast strip rates with very high metal loading.
- Proprietary additives minimize copper attack and sludge formation.
- Can be used to strip HAL solder when reworking is required.
- Use TSN-3100 in batch or continuous replenishment applications.
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