A semi-aqueous photoresist stripper concentrate formulated specifically to stripdry film from between very fine lines and underneath overplated features.
- Combines alkaline amines with glycol ethers to provide the absolutely smallest dry film particles over the entire loading range of the process.
- Strips quickly and leaves the copper surface clean and free of oxidation.
- Designed to completely remove the tenacious adhesion promoters used in many of today’s photoresists.
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