FOCUSTECH™ TSN-3000
Description
Strips tin and solder etch resists quickly and cleanly and leaves the underlying copper surface with a bright, uniform finish.
Key Properties
- Concentrated formulation allows the user to maintain fast strip rates with very high metal loading.
- Proprietary additives minimize copper attack and sludge formation.
- Can be used to strip HAL solder when reworking is required.
- Use TSN-3000 in batch or continuous replenishment applications.
Documentation
Tools
Explore our latest webinars, glossary, conversion calculator and more.