equipment
We now support our customers with Equipment Technical Service. By having a team of technicians that have 7-20+ years of experience and also know the process, they can work together with Insulectro's Field Application Engineers to fully troubleshoot or improve a production process.
About equipment
InduBond® has long been respected for tight accuracy in registration, its lamination presses, automation (automatic loading/unloading), and its eco-friendly best practices. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material. Ensuring each layer of the press pack is exposed to the same temperature, pressure and vaccum at the same time without any thermal delay.
custom services
- Service and Support
- Audits and Reviews
- Preventative Maintenance Programs
InduBond® Lamination & Registration Systems
A high temperature induction lamination press capable of fusion bonding, up to 850°F. Achieves a consistent rate of rise up to 40°F per min on low layer counts and holds less than 2°F panel temperature variance within the press stack. The thermal energy is transferred directly on to the laminates enhancing flow and fill rates. In conjunction with supporting programable cycles, which combined use less than 50KW/h.
A single head induction bonding system which incorporates a manual multi-line tooling plate with either round and/or slotted pins for pinless lamination. Can support either Rigid or Rigid-flex designs, panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a single draw layup function and incorporated tooling plate for registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a double draw layup function and incorporated tooling plate allowing for sequential registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
Pin registration system with 4 independent heads to bond any locations in and around the perimeter of the panel, supporting Flex and Rigid-Flex designs. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry. Panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.