DuPont™ COPPER GLEAM™ 125-EX
Description
High throughput, fine grained DC acid copper plating process. Designed for plating applications with 10-30 ASF requirements where throughput and ease of control is desired.
Key Properties
- Fine-grained, equiaxed copper deposit
- Suitable for panel or pattern plating applications
- Excellent tensile strength, elongation & solderability
- Easy to control – Hull Cell and/or CVS
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