COPPER Foil
Insulectro stocks, distributes and supports Copper Foil for Rigid, Rigid-Flex and Flex designs.
About COPPER FOIL
Insulectro offers Copper Foils from many world-class producers that are designed to help our customers achieve their high-performance design parameters.
These foils cover Electrodeposited (ED) and Wrought (RA) needs with all materials released to the Printed Circuit Boards industry standard of IPC-4562.
Foil options from 1.5µm up to 105µm as standard, heavier coppers on request all to support superior adhesion, signal integrity for HSD, HDI, RF and MSAP requirements.
Our technical expertise can help connect the right material for your Rigid, Rigid-Flex or Flex design.
Copper Foil Resources
A cheat sheet on how to understand the IPC spec, and see your foil in action!
Introduction to copper foil treatment layer chemistry and when As free foils contains 0.05% per REACH is acceptable.
Introduction to the basics of skin effect and the benefits of using very low profile copper Rz 2µm max.
Rigid and Rigid-Flex Circuits
Highly reliable, matte side treated grade 3 HTE electrodeposited foil for outer layer applications with excellent adhesion propeties on a wide range of resin systems.
Low-profile, high tensile strength electrodeposited copper foil, suitable for fine etching in the subtractive process. Used to support semiconductor packages, HDI, and Flexible PCB. With treatment on the matte side of the foil.
Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.
Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.
Application:Highest peel strength, O/L bonding.
Peel strength is a critical factor when using a no flow or low flow resin system, as a failure to bond could lead to delamination in the field. Fortunately, Camden Copper HP2 is a high copper nodule density foil released to IPC 4562 grade 3 standard to solve this concern. Due to both it’s superior surface chemistry and profile it can exceed IPC4101 slash sheet minimums and be used on various resins from for epoxy, Pi, PPO PPE resins. This domestically made copper foil is available in several thickness please see the technical data sheet for details.
Application: High Temperature foil for epoxy and PI resins.
A highly versatile IPC 4562 grade 3 foil designed to support applications from standard epoxy to higher temperature polyimide resins. This foil balances bond strength and signal performance needs whilst simplifying your material needs that previously specified TOBIII separately. This domestically made copper foil is available in several thickness please see the technical data sheet for details.
Reverse Treatment
JX Metals Corporation JXEFL
Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.
Flexible Circuits
Very low-profile, rolled-wrought, low-temperature annealable foil with excellent dynamic and static flex properties due to enlarged grain structure and orientation. Suitable for Flexible and Rigid-Flex PCB applications.
Very low profile, annealed-wrought foil suitable for flexible PCB applications. Available in single or double treated finishes.
MSAP (Tighter Line Spaces)
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 35/35 or less.
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 20/20 or less.
Arsenic-Free Coppers
Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.
Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.
Highly reliable, matte side treated grade 3 HTE electrodeposited foil for outer layer applications with excellent adhesion propeties on a wide range of resin systems.