DuPont™ CONDUCTRON™
Description
Unique palladium colloid (Pd-Cu) based process for through-hole and blind microvia applications. Creates one of the most conductive direct plate coatings on the market.
Key Properties
- Excellent reliability for FPC & RFPC applications
- No reliance on a post-coating microetch
- Environmentally friendly – no formaldehyde
- Compatible with horizontal or vertical applications
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