LOW-LOSS RF DIELECTRICS
Material choice can make or break your designs performance. We offer solutions.
About LOW-LOSS RF DIELECTRICS
Low-loss is our business. Whether it be attempting to minimize insertion loss or hit targeted impedance values, we have materials for all marketplaces. Our materials are uniquely suited for pure package or hybrid design.
custom services
- PumaFast™
- Rewinding Services
- Manufacturing Technical Support
- Designer Support
RF Pure-Package & Hybrid Designs
Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.
High Tg / Very Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC-4103 /240, /540.
Designed for high thermal reliability with excellent CAF resistance. Applications include: high-speed Ethernet, network, HPC, AI, 5G, and antenna.
High Tg / Ultra Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC 4101 /134; IPC-4103 /230, /530.
DuPont™ Flex Materials for RF Applications
An innovative low loss epoxy adhesive for high speed flex designs.
A clad and bondply material constructed with FEP layers to minimize loss for RF based designs.
The industry standard flex substrate with incredibly low loss dielectrics to be used with HT film, TK bond plys or HP epoxy adhesives for low loss flex designs.
Copper Foil
Also known as Rolled Annealed foil is often used for RF applications. It’s available as loose sheets for foil lamination with low loss dielectrics.