Skip to the content

Request access to our Inventory Portal today

InsulectroInsulectro
  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • CELANESE MICROMAX®
      • ARLON ELECTRONIC MATERIALS
      • EMC (ELITE MATERIALS COMPANY)
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Magazine
  • Careers
  • Customer Portal
Contact
  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • CELANESE MICROMAX®
      • ARLON ELECTRONIC MATERIALS
      • EMC (ELITE MATERIALS COMPANY)
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Magazine
  • Careers
  • Customer Portal
Contact
Company News
January 29, 2020
INSULECTRO AND DUPONT SET TO ENGAGE IPC APEX EXPO ATTENDEES WITH POWERFUL POWER CHATS™

Insulectro (www.insulectro.com), the largest distributor of materials for use in the printed circuit board and printed electronics industries, has announced a blow-out schedule of its highly anticipated 13.5-minute power chats in cooperation with DuPont, and EMD Performance Materials during this year’s IPC APEX EXPO at the San Diego Convention Center, February 4-6, 2020.

With top DuPont execs and engineers presenting on such breakthrough topics as 5G, Automotive, and Highly Reliable Films and Laminates, the Insulectro Power Chats, branded ipc@IPC, will be presented in a brand-new three-quarter round theatre presentation in Insulectro’s new 1800 square foot mega-booth – #625, the largest exhibit in the suppliers and materials section.

“We are pleased to take our ipc@IPC – Insulectro Power Chats, to the next level with our valued supplier, DuPont,” commented Ken Parent, Vice President of Sales & Product Management, “DuPont has developed six amazing presentations that should be of top interest to fabricators and OEMs. The Chats are topical, short, info-packed learning sessions presented by experts in the field during IPC APEX EXPO. In 13.5 minutes per Chat, attendees will learn the WHAT/WHY/HOW of these industry game changers.”

 “DuPont is leading the pack with cutting edge engineering on new technologies that are expected to have a major impact on everyone’s life,” stated Michelle Walsh, Insulectro Director of Product Management, who also moderates the sessions, “to accommodate the demand these sessions are likely to generate, we’ve increased our exhibit space substantially to create a theatrical environment for presenter and audience alike.

“We’re delighted to bring the presenters and topics to IPC, for the first time, to explore both the far-reaching vision and new processes that are being developed by the New DuPont. It’s a great chance to experience how an industry pioneer thinks about the future. Over the past seven years our IPC Power Chats have been enormously popular. Often times, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year promises to be no exception,” Walsh concluded.

 

IPC@IPC DuPont Power Chats Schedule for Booth #625:

(Business Card drawing for Amazon Echo Dot at conclusion of each session)

Design Without Compromise: High Reliability Pyralux® Applications

(January 29: 11:00am; January 30: 10:00am, 4:00pm; January 31: 10:00am)

From space orbit to the operating room, advanced systems are made possible by Kapton® Films.

Matt Guise, DuPont Global Marketing & Business Development Leader

Dave Reichert, DuPont Global Business Development

Design Without Compromise: Specialty Kapton® Applications

(January 29: 2:30pm; January 30 2:00 pm)

Aircraft, undersea platforms, and power electronics: advanced packaging solutions enabled by

Pyralux® laminates and high-performance thermal substrates.

Matt Guise, DuPont Global Marketing & Business Development Leader

Tim Scott, DuPont Global Business Development

 

5G. What It Means to You

(January 29: 4:30pm; January 30: 1:00pm; January 31: 11:00am)

The eco-structure of 5G and How DuPont can help.

Brian Amos, DuPont Global Technical Marketing

 

5G. High Frequency Flex

(January 29: 5:00pm; January 30: 1:30pm; January 31: 11:30am)

Materials matter.

Jonathan Weldon, DuPont RF Applications Engineer

It’s Hot under the Hood

(January 29: 1:30pm; January 30: 11:00am, 5:00pm)

Flexible Laminates for Harsh Automotive Environment – TCU

Romaine Delorme, DuPont Global Marketing & BD Leader – Automotive

 

Automotive Electronics – It’s a Tough Job

(January 29: 3:30pm; January 30: 3:00 pm)

High Performance Thermal Conductive Substrates for Reliable Power Module Packaging

Romaine Delorme, DuPont Global Marketing & BD Leader – Automotive

All Power Chats are in Space #625 at IPC APEX EXPO. No sign-up required, and topics are repeated by your convenience. Printed schedules available in Insulectro Booth #625 or by download from www.insulectro.com

Corporate Headquarters

Insulectro
20362 Windrow Drive
Lake Forest, CA 92630
Directions

View Stocking Locations

Contact

General Inquiries
Contact Us
Call (949) 587-3200

Job Opportunities
We’re hiring!
View open positions

Connect with Us
  • LinkedIn
  • YouTube
  • Vimeo

© Copyright 2025 Insulectro All trademarks belong to their respective owners.

Legal Privacy Policy

Some U.S. state privacy laws offer their residents specific consumer privacy rights, which we respect as described in our Privacy Policy. To opt-out of our making available to third parties information relating to cookies and similar technologies for advertising purposes, select "Opt-Out". AcceptOpt-OutPrivacy policy