Insulectro has announced a blow-out schedule of its highly anticipated 13.5-minute power chats in cooperation with DuPont, InduBond® and EMD Electronics during this year’s IPC APEX EXPO at the San Diego Convention Center, January 25- 27.
With top execs and engineers presenting on such breakthrough topics as 5G, Automotive, and the introduction of new Films and Laminates, the Insulectro Power Chats™, branded ipc@IPC, will be presented in a three-quarter round theatre presentation in Insulectro’s 1800 square foot mega-booth – #3233, the largest exhibit in the suppliers and materials section.
“We are pleased to take our ipc@IPC – Insulectro Power Chats, to the next level with our valued suppliers, DuPont, and EMD by presenting a new topic every 30 minutes” commented Ken Parent, Chief Operating Officer, “We have 35 amazing presentations that should be of top interest to fabricators, designers, and OEMs. The Chats are topical, short, info-packed learning sessions presented by experts in the field during IPC APEX EXPO. In 13.5 minutes per Chat, attendees will learn the WHAT/WHY/HOW of these industry game changers.” The Power Chats will rotate and repeat during the show’s three days of exhibition.
“These key suppliers are leading the pack with cutting edge engineering on new technologies that are expected to have a major impact on everyone’s life,” stated Michelle Walsh, Insulectro Vice President of Product Management, who also moderates the sessions, “To accommodate the demand, our Power Chats™ are likely to generate, we’ve increased our exhibit space substantially to create a theatrical, but safe, environment for presenter and audience alike.
“Of particular note, Andy Kannurpatti, DuPont Business Director ICS is scheduled to present: “DuPont—Partnering with Customers to Provide Sustainable Materials Solutions for Advanced Interconnects” at 2:00 pm on January 25, repeating at 11:00 am on January 26.
Ken continued, “We are pleased also to introduce Victor Lazáro Gallego, inventor of the InduBond® induction press to North American fabricators. Victor, who is Technical Director for InduBond® for Chemplate Materials, S.L. in Barcelona, Spain, will present a Power Chat™ on ‘Indubond® Lamination, Registration, and Automation.’ Victor will be presenting 4:00 pm on January 25, and 11:30 am on January 26.”
“We’re delighted to bring many of these presenters and topics to IPC, for the first time, to explore both the far-reaching vision and new technologies and products that are being developed. It’s a great chance to experience how industry visionaries think about the future. Over the past nine years, our IPC Power Chats have been enormously popular. Most times, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year promises to be no exception,” Walsh concluded.
IPC@IPC Power Chats™
Topics and Schedule for Booth #3233:
(Business Card drawing for Amazon Echo Dot, Google Nest Mini at conclusion of each session)
VISION
DuPont—Partnering with Customers to Provide Sustainable Materials Solutions for Advanced Interconnects
To address growing megatrends such as 5G connectivity and electric/autonomous vehicles, the printed circuit board industry must address issues such as reliable signal integrity and thermal management and do so with sustainable solutions. In this presentation, learn how DuPont is partnering with customers to provide critical interconnect solutions by leveraging its broad, growing and sustainable portfolio, deep material and applied science expertise.
Andy Kannurpatti, Global Business Director – DuPont ICS Films & Laminates
MATERIALS & SELECTION
OEMs’ Guide to Materials Selections
Material Decisions Affect Performance, Price, and Producibility of Our Circuits. Our PCB/PCA products are used in so many industry sectors, with varied types of circuitry with so many different manufacturing considerations. Never let someone unqualified make these decisions for your company. Make the right informed choice by looking at all perspectives.
Michael Creeden CID+ MIT , Insulectro Technical Director
New Base Materials for 5G Telecommunications
5G telecommunications encompass a broad range of operating frequencies. For high band applications, new base materials are needed to support high-speed digital signal transmission, where requirements for Dk and Df exceed the today’s capability of conventional base materials. These emerging requirements make every component of the base material critical – the resin system, fillers, flame retardants, reinforcements, and copper foils. Integrating these raw materials into products that meet signal integrity requirements while also meeting reliability, CAF resistance and processability needs will be addressed.
You Need DuPont™ Interra™ More Than Ever!
Learn how DuPont’s Interra™ line of thin embedded capacitor materials can improve power distribution networks by lowering the overall impedance and allow design flexibility for component placements due to the reduced number of discrete capacitors required.
Greg Roettger, Key Account Manager, DuPont CPM
New Offerings in Metallization Chemistry
From high volume HDI to IC substrate technology, copper plating into blind via features enables a higher density of interconnects. However, one plating chemistry does not t all applications. Learn how DuPont has developed a new suite of copper via-filling products designed to meet the needs of customers.
Erik Reddington, Strategic Engagement Leader – DuPont Electronics &
Imaging
Ormet® Z-Axis Interconnects for Dense Circuits
Ormet® Z-Axis Interconnect is a game changer. The need for HDI solutions has been around for some time using traditional methods to solve the challenges. This has created challenges to the fabrication process due to stresses of multiple lamination cycles, via and material stress. Along with plating challenges for high-aspect ratio vias on high layer count boards. Come learn how Ormet® sintering paste from EMD Electronics solves all these challenges
Michael Creeden CID+ MIT , Insulectro Technical Director
TECHNOLOGY
TLPS Paste Technology – Products & Applications
Ormet® pastes are becoming a popular way to form z-axis interconnects in PCB. The paste utilizes Transient Liquid Phase Sintering technology to achieve this. By changing some of the paste attributes, it has other applications. We will review the principles of the technology and present on other ways and products used in electronic builds. Catherine Shearer, EMD Electronics & Chris Hunrath, VP of Technology – Insulectro
Where is the Energy that Our Circuits Produce?
Electro-Magnetic Theory – getting the best use from the best laminates from DuPont. In today’s high-speed and RF circuits, you are not routing interconnects, you are managing EM fields and knowing where these fields exists is paramount to Signal Integrity performance. You can use the best material, but you need to know how to get the best use from that material.
Michael Creeden CID+ MIT , Insulectro Technical Director
InduBond® Lamination, Registration, Automation
InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.
Presented by Victor Lazáro Gallego, Technical Director and InduBond® inventor at Chemplate Materials, S.L.
Copper Foils for High Speed & Fine Line (mSAP) Designs
Copper foil in PCB builds is no longer simply a matter of thickness (oz/sqft). Today, there are many foil types available. More and more designs are calling out specific foil characteristics. In this chat we will be reviewing some of the many types available and help “connect the dots” between the specs and the foil needed to deliver the design attributes.
Chris Hunrath, VP of Technology – Insulectro
High Temperature Lamination and Fusion Bonding
High temperature thermoplastic materials have found their way into PCB builds. They have some unique signal characteristics as well as applications in flexible circuit technology. In this chat we will discuss some of the material sets, lamination and other processing at the PCB fabricator.
Chris Hunrath, VP of Technology – Insulectro
PRINTED ELECTRONICS
Advancements in Ag/AgCl for Bio & E-Health
DuPont has expanded its portfolio of printable Ag/AgCl and carbon pastes for biomedical sensors, health patches, and test strips. These new pastes show improved properties such as solvent resistance, better printability, flexibility/bendability, paste stability, and accurate/stable electrode performance.
HV Tran, DuPont MCM Technology
Polyimide Pastes for High Temperature Applications
To meet our customers’ needs for applications requiring electronic ink with high thermal/chemical resistance on ex/rigid substrates, DuPont has developed direct printable polyimide dielectrics, resistors, and conductors. Learn about the technical features, product benefits, and potential applications of the new KA series.
HV Tran, DuPont MCM Technology
DESIGN EDUCATION
Success! Working with your Fabrication Supply Chain
With increasing challenges in our circuit requirements, the danger of delaying fabricator involvement can significantly reduce reliability and producibility, resulting in lower yields and higher costs. When circuits are in development the circuit boards should not be considered a commodity rather, they require proactive co-engineering with your supply chain. This success can reduce costs & delays in: Material Recommendations, Stack-up Suggestions, HDI, RF, Flex, Rigid-Flex, SI & DFX. Michael Creeden CID+ MIT , Insulectro Technical Director
All Power Chats are in Space #3233 at IPC APEX EXPO. No sign-up required, and topics are repeated by your convenience. Complete schedules available in Insulectro Booth #3233, or at insulectro.com.
Insulectro supplies advanced engineered materials manufactured by DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, InduBond®, Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.
For further information, please contact:
John A. Lee
Vice President of Marketing & Brand Strategy
Insulectro
949.587.3326 [email protected]