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InduBond®
About Indubond®
InduBond® has long been respected for tight accuracy in registration, its lamination presses, automation (automatic loading/unloading), and its eco-friendly best practices.
InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.
InduBond® Lamination & Registration Systems
A high temperature induction lamination press capable of fusion bonding, up to 850°F. Achieves a consistent rate of rise up to 40°F per min on low layer counts and holds less than 2°F panel temperature variance within the press stack. The thermal energy is transferred directly on to the laminates enhancing flow and fill rates. In conjunction with supporting programable cycles, which combined use less than 50KW/h.
A single head induction bonding system which incorporates a manual multi-line tooling plate with either round and/or slotted pins for pinless lamination. Can support either Rigid or Rigid-flex designs, panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a single draw layup function and incorporated tooling plate for registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
An induction bonding Pin registration system with 4 heads which can bond targets around the perimeter of the panel supporting Rigid designs. Has a double draw layup function and incorporated tooling plate allowing for sequential registration activities using round and/or slotted pins. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry.
Pin registration system with 4 independent heads to bond any locations in and around the perimeter of the panel, supporting Flex and Rigid-Flex designs. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry. Panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.