![logo-dupont@2x logo-dupont@2x](https://insulectro.com/wp-content/uploads/2021/09/logo-dupont@2x.jpg)
COPPER GLEAM™ 2001
Description
High aspect ratio, high throwing power DC acid copper plating system suitable for panel or pattern plating applications. Exhibits excellent leveling and thickness distribution with a current denisty range of 5-20 ASF.
Key Properties
- Uniform, bright, ductile deposit
- Excellent throwing power & thickness distribution
- Excellent through-hole micro-leveling
- Full analytical control of additive system by CVS
Documentation
Contact
Our expert team is here to assist with all questions and considerations.
![](https://insulectro.com/wp-content/plugins/elementor/assets/images/placeholder.png)
Geoffrey Leeds
Tools
Explore our latest webinars, glossary, conversion calculator and more.
- Education
- Customer Portal
- RHOS/Prop 65 Compliance