COPPER GLEAM™ 2001
High aspect ratio, high throwing power DC acid copper plating system suitable for panel or pattern plating applications. Exhibits excellent leveling and thickness distribution with a current denisty range of 5-20 ASF.
- Uniform, bright, ductile deposit
- Excellent throwing power & thickness distribution
- Excellent through-hole micro-leveling
- Full analytical control of additive system by CVS