Description

High aspect ratio, high throwing power DC acid copper plating system suitable for panel or pattern plating applications. Exhibits excellent leveling and thickness distribution with a current denisty range of 5-20 ASF.

Key Properties

  • Uniform, bright, ductile deposit
  • Excellent throwing power & thickness distribution
  • Excellent through-hole micro-leveling
  • Full analytical control of additive system by CVS

 

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