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Demonstrations on products manufactured by DuPont, Celanese Micromax™ Isola, LCOA, Pacothane, Denkai America, Focus Tech, Ormet Circuits, and CAC generated huge interest in applications for High-Speed Digital, RF/Microwave, Drill Room efficiency, and Printed Electronics.

Tue. January 24

Wed. January 25

Thur. January 26

Insulectro’s Technology Village
Michael Creeden
Technology Director, Insulectro

Tool Selection for Flex/Rigid-Flex Drilling & Milling
Russell Reynoso
Design and Engineering Mgr, Kyocera

Paste with Ultra-Thin Foils for Build-Up HDI
Chris Hunrath
VP of Technology, Insulectro

DuPont Automotive Solutions
Greg Roettger
Sr. Key Account Mgr, DuPont

New DuPont Resist for SAP/mSAP
Chris Cha
Technical Service Consultant, DuPont

New Plating Chemistry
Carl Colangelo
Technical Sales Manager, DuPont

Cutting Tools for Advanced Materials and HDI Joe Negron
Sales Manager, Kyocera

Microvia Reliability
Geoffrey Leeds
DuPont Flex Laminates Product Mgr, Insulectro

Data Collection: The 4.0 Way
Geoffrey Leeds
DuPont Flex Laminates Product Mgr, Insulectro

Making Intelligent Materials Selection Michael Creeden
Technology Director, Insulectro

Metallization & Imaging Processes for IC Substrates
Erik Reddington PhD
Commercial Leader, DuPont

15 Emerging Predictions for Advanced Electronics
Michael Creeden
Technology Director, Insulectro