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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
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    • PUMANEWS™ Newsletter
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Company News
November 22, 2021
BIG WEEK FOR EQUIPMENT MANUFACTURER INDUBOND®

On Tuesday, November 16, Productronica 2021 in Munich, Germany, opened its doors to an eager audience looking for some sense of normality at the continent’s biggest electronics exhibition. InduBond® was in the thick of things showing their new double-entry X-Press 360, which uses a revolutionary new way of laminating PCBs. The press uses induction heating technology to deliver precisely the energy needed to cure the resins with no thermal delays in any direction of the stack – X, Y, and Z direction.

The press was shown with a proprietary stack-up from Insulectro named CSC (copper-steel-copper.)

InduBond® was also in the news with photographs of its massive expansion at its Barcelona HQ. The expansion will help increase capacity to match the demand this system is causing.

Lastly, InduBond’s® North American distributor, Insulectro, has announced its first sale of the X-Press 360 system to premiere fabricator APCT in Southern California – a harbinger of what’s to come as the NA PCB market becomes aware of the unique capabilities of InduBond® and its lamination and automation equipment.

Click here to explore InduBond’s product line

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