Isola® P25N
Description
The P25N product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications such as Flexible circuits and Heat Sink bonding..
Key Properties
The P25N no flow resin system is suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.
- Dk : 3.67
- Df :.018
- UL: HB
- IPC slash sheet: 4101 /42
- Tg: 250 C
- Td 383 C
- Halogen Free: No
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