Description

Key Properties

FR406 No-Flo® and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.

  • Dk : 4.3
  • Df : .025
  • UL: V-0
  • IPC slash sheet: 4101 /21, /24, and /26.
  • Tg: 170 C
  • Td 300 C
  • Halogen Free: No

Documentation

Tools

FR406N®