185HR laminate and prepreg materials are a proprietary, high-performance resin system for FR4 multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required.
The 185HR delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.
- Dk : 4.1
- Df :.020
- UL: V-0
- IPC slash sheet: 4101 /98, /99, /101, and /126
- Tg: 180 C
- Td 340C
- Halogen Free: No